PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD5L SOT-23 All Date CodesMatte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0160
MCP73832T-2DCI/OT |
RFQ for MCP73832T-2DCI/OT |
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| Technical/Catalog Information | MCP73832T-2DCI/OT |
| Vendor | Microchip Technology (VA) |
| Category | Integrated Circuits (ICs) |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP73832T 2DCI OT MCP73832T2DCIOT MCP73832T 2DCI OTDKR ND MCP73832T2DCIOTDKRND MCP73832T-2DCI/OTDKR |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP73832T-2DCI/OT | - | - | - |